不同工艺参数下DLC薄膜的应力状态

类金刚石(DLC)薄膜制备过程中,容易出现较大应力,从而导致DLC薄膜产生裂纹、破裂甚至脱落,对基底过早失去保护作用,导致光学系统失效,严重影响了DLC薄膜的工作时间和应用领域。基于射频磁控溅射技术,在双面抛光Si(100)基底上,沉积DLC薄膜,制备不同射频功率(250、350、450 W)、不同氩气流量(40、60、80 mL/min)、不同溅射角(30°、60°、90°)下的DLC薄膜,获得不同工艺参数对DLC薄膜应力的影响规律。经过测试结果表明:在相同的基底形状与尺寸下,当射频功率为350 W,氩气流量为60 mL/min,溅射角为90°时,薄膜的应力表现出最小值,为0.85 GPa。

Stress Reduction of Diamond-Like-Carbon Coatings by Growth Optimization

We reported a significant reduction of stress in diamond like carbon(DLC) coatings,especially at the interface,deposited by RF magnetron sputtering on substrate of double-side polished Si(100) wafer.The influence of the RF sputtering power,glancing angle and argon flow-rate on the stress distribution was investigated with atomic force microscopy and Raman spectroscopy.The results show that the stress in DLC coatings can be considerably significantly reduced under the optimized synthesis conditions.To be specific,Formation of defects,including the vacancies,interstitial atoms/impurities originated from bombardment of high-energy ions,increased the stress because of the increased volume/non-uniform distribution of sp³ and decreased compactness.An optimized ion-energy makes the difference.Deposited at a RF sputtering power of 350 W,an argon flow-rate of 60 mL/min,and a glancing angle of 90°,the minimum stress in DLC-coating was found to be 0.85 GPa.