| 高导热材料的铝基板加工技术 |
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| 引用本文： | 王优林.高导热材料的铝基板加工技术[J].印制电路信息,2008(12):52-54. |
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| 作者姓名： | 王优林 |
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| 作者单位： | 中京电子,广东,惠州,516008 |
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| 摘 要： | 文章通过对高导热材料制作的铝基板的加工工艺试验的总结，提出了加工工艺，解决了加工中的难题，为高导热材料制作的特种印制板的批量生产奠定了基础。
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| 关 键 词： | 高导热材料 铝基板 加工工艺技术 |
Processing Technology of High Thermal Conductive Aluminum Substrate |
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| WANG Youlin.Processing Technology of High Thermal Conductive Aluminum Substrate[J].Printed Circuit Information,2008(12):52-54. |
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| Authors: | WANG Youlin |
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| Affiliation: | WANG You-lin |
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| Abstract: | The article through to the high thermal conduction material manufacture's aluminum foundation plate's processing engineer testing's summary,proposed the processing craft,has solved in the processing difficult problem,has laid the foundation for the high thermal conduction material manufacture's special board's volume production. |
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| Keywords: | high thermal conductivity material aluminum plate processing technology |
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