低毒室温固化环氧树脂复合体系的研究

环氧树脂的室温固化体系通常多采用脂肪胺类作固化剂。如乙二胺等。但其毒性一般较大，强度和耐热性偏低。本文研究了一种低毒室温固化体系。由环氧树脂的新型固化剂DDDM（3，3＇二乙基4，4＇二氨基二苯甲烷）和低分子聚酰胺、三乙醇胺及活性稀释剂U－45组成。该体系的毒性大大低于乙二胺体系，而力学性能却高于乙二胺体系。由于采用了活性稀释剂U－45，不仅改善了该体系的工艺性能，同时其强度也有提高。该体系可用于室温固化的玻璃钢、胶粘剂、浇铸料等领域。

STUDY ON AN EPOXIES COMPLEX SYSTEM WITH LOW TOXICITY FOR ROOM TEMPERATURE CURING

The curing agent system for epoxy resins at room temperature was usually type of aliphatic amines such as ethylenediamine, which has disadvantages of poison, low strength and poor heat resistance. A new type of complex curing system with low toxicity for epoxy resins at room temperature was studied in this paper. It was made up of a new curing agent,3, 3'-diethyl-4, 4'-diaminodiphenylmethane (DDDM ), low-molecular polyamide, tri-ethanolamine and reactive diluent U-45' Its toxicity is much lower than that of ethylenedi-amine, but the mechanical properties of the resin cured from it were better than that from ethylenediamine. Addition of reactive diluent U-45 improved not only processabilities of sys-tem but also the strength. It can be applied to areas of glassfiber reinforced plastics, adhe-sives, and resin casts, cured at room temperature.