Mixage ionique sur des structures Au/InP

The reactions induced by Zn⁺ implantations near the interface of Au/InP contacts have been studied by using scanning electron microscopy, X-ray diffraction, He⁺ Rutherford backscattering, secondary ion mass spectrometry and current-voltage measurements. A 5 × 10¹⁴ Zn ions cm^-2 dose does not induce compound formation but accelerates the growth of Au₃In and Au₂P₃ patches during post-annealing treatment. After a 5 × 10¹⁵ Zn ions cm^-2 implantation, many compounds, different from those obtained by a thermal anneal, are detected. These compounds, which depend on the implantation temperature (25 or 200°C), have a layered structure. In this case no Au₂P₃ is observed. However, for the range of doses (from 10¹⁴ to 5 × 10¹⁵ Zn ions cm^-2), the temperatures of implantation (25 and 200°C) and the range of annealing temperatures (from 320 to 450°C) that were studied, no contact with a low resistivity is formed. The electrical properties are in fact limited by an InP layer damaged by the ion implantation in which the zinc atoms are trapped in an electrically inactive form.