| 白光LED封装工艺对其性能的影响 |
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| 引用本文： | 郑毅夫. 白光LED封装工艺对其性能的影响[J]. 现代显示, 2008, 19(3): 60-63 |
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| 作者姓名： | 郑毅夫 |
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| 作者单位： | 厦门华侨电子企业有限公司,福建,厦门,361006 |
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| 摘 要： | 通过理论分析与实验数据说明了白光LED封装工艺对其性能的影响,特别针对模粒卡位、胶体外形等进行较为详细的分析。
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| 关 键 词： | 封装工艺 白光LED 封装材料 |
| 文章编号： | 1006-6268（2008）03-0060-04 |
| 收稿时间： | 2008-01-14 |
| 修稿时间： | 2008-01-14 |
Analysis on White Light LED Packaging Process and its Performance |
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| ZHENG Yi-fu. Analysis on White Light LED Packaging Process and its Performance[J]. Advanced Display, 2008, 19(3): 60-63 |
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| Authors: | ZHENG Yi-fu |
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| Abstract: | The influences of white light LED packaging process on its performance are discussed in this paper. We also analyse the factors including colloid outlines and sticking points in detail. |
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| Keywords: | packaging process white light LED packaging materials |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
