Effect of Strain Rate on Evolution of the Deformation Microstructure and Texture in Polycrystalline Copper and Nickel |
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Authors: | Nilesh P. Gurao Rajeev Kapoor Satyam Suwas |
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Affiliation: | (1) Department of Materials Engineering, Indian Institute of Science, Bangalore, 560012, India;(2) Bhabha Atomic Research Centre, Mumbai, 400085, India; |
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Abstract: | The evolution of crystallographic texture in polycrystalline copper and nickel has been studied. The deformation texture evolution in these two materials over seven orders of magnitude of strain rate from 3 × 10−4 to ~2.0 × 10+3 s−1 show little dependence on the stacking fault energy (SFE) and the amount of deformation. Higher strain rate deformation in nickel leads to weaker á 101 ñ leftlangle {101} rightrangle texture because of extensive microband formation and grain fragmentation. This behavior, in turn, causes less plastic spin and hence retards texture evolution. Copper maintains the stable end á 101 ñ leftlangle {101} rightrangle component over large strain rates (from 3 × 10−4 to 10+2 s−1) because of its higher strain-hardening rate that resists formation of deformation heterogeneities. At higher strain rates of the order of 2 × 10+3 s−1, the adiabatic temperature rise assists in continuous dynamic recrystallization that leads to an increase in the volume fraction of the á 101 ñ leftlangle {101} rightrangle component. Thus, strain-hardening behavior plays a significant role in the texture evolution of face-centered cubic materials. In addition, factors governing the onset of restoration mechanisms like purity and melting point govern texture evolution at high strain rates. SFE may play a secondary role by governing the propensity of cross slip that in turn helps in the activation of restoration processes. |
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