| 聚酰亚胺在MEMS中的特性研究及应用 |
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| 引用本文： | 邓俊泳,冯勇建. 聚酰亚胺在MEMS中的特性研究及应用[J]. 微纳电子技术, 2003, 40(4): 30-33 |
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| 作者姓名： | 邓俊泳 冯勇建 |
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| 作者单位： | 1. 厦门大学机电工程系,福建,厦门,361005
2. 厦门大学萨本栋微机电研究中心,福建,厦门,361005 |
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| 摘 要： | 聚酰亚胺具有耐高温、耐腐蚀、绝缘性能好、化学性质稳定等特点,在MEMS工艺中有很广泛的应用前景,适于做牺牲层、绝缘层和平坦层等。在简要介绍聚酰亚胺的基础上,着重介绍聚酰亚胺在MEMS工艺中的特性、工艺流程及应用。
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| 关 键 词： | 聚酰亚胺 MEMS 高分子材料 |
| 文章编号： | 1671-4776(2003)04-0030-04 |
| 修稿时间： | 2002-12-23 |
Characteristic and application of polyimide in MEMS |
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| DENG Jun-yong ,FENG Yong-jian. Characteristic and application of polyimide in MEMS[J]. Micronanoelectronic Technology, 2003, 40(4): 30-33 |
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| Authors: | DENG Jun-yong FENG Yong-jian |
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| Affiliation: | DENG Jun-yong 1,FENG Yong-jian 2 |
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| Abstract: | Polyimide can resist high temperature and etching,and has excellent properties of in-sulation and chemical stabilization.It would be applied widely in MEMS process,especially befit to be used as sacrificing layer,insulating layer,smooth layer,etc.Based on the simple intro-duction of polyimide,the characteristic,process flow and applications in MEMS are introduced emphatically. |
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| Keywords: | polyimide MEMS high molecular compound material |
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