| 低温陶瓷共烧技术——MCM-C发展新趋势 |
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| 引用本文： | 冉建桥,刘欣,唐哲,刘中其. 低温陶瓷共烧技术——MCM-C发展新趋势[J]. 微电子学, 2002, 32(4): 287-290 |
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| 作者姓名： | 冉建桥 刘欣 唐哲 刘中其 |
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| 作者单位： | 信息产业部,电子第二十四研究所,重庆,400060 |
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| 摘 要： | 介绍了目前国际上厚膜混合工艺技术的动态，指出了低温共烧陶瓷技术(LTCC)是MCM-C发展的重要趋势。探讨了国内MCM-C技术的现状，认为必须同IC技术保持紧密的联系，才能得到良好的发展。
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| 关 键 词： | 低温共烧陶瓷 MCM-C 厚膜混合工艺 |
| 文章编号： | 1004-3365(2002)04-0287-04 |
| 修稿时间： | 2001-10-08 |
Low Temperature Co-fired Ceramic-the Development Trend of MCM-C |
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| RAN Jian qiao,LIN Xin,TANG Zhe,LIU Zhong qi. Low Temperature Co-fired Ceramic-the Development Trend of MCM-C[J]. Microelectronics, 2002, 32(4): 287-290 |
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| Authors: | RAN Jian qiao LIN Xin TANG Zhe LIU Zhong qi |
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| Abstract: | The latest development of thick film technology in the world is described in the paper It is pointed out that low temperature co fired ceramic (LTCC) is the development trend for MCM C technology Furthermore, the current situation of MCM C technology in China is discussed |
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| Keywords: | LTCC MCM C Thick film technology |
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