| MEMS晶圆级测试系统现状及未来展望 |
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| 引用本文： | 乔玉娥,刘岩,程晓辉,丁立强,丁晨,梁法国. MEMS晶圆级测试系统现状及未来展望[J]. 传感器与微系统, 2016, 0(10). DOI: 10.13873/J.1000-9787(2016)10-0001-03 |
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| 作者姓名： | 乔玉娥 刘岩 程晓辉 丁立强 丁晨 梁法国 |
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| 作者单位： | 中国电子科技集团公司 第十三研究所,河北 石家庄,050051 |
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| 摘 要： | 微机电系统（ MEMS）产品的广泛应用使得晶圆级测试技术必要性日益凸显。分析了国内和国际MEMS晶圆级测试系统硬件和MEMS晶圆级测试技术的现状。参照国际上利用RM8096/8097标准物质（ RM）对MEMS产品进行计量测试的方法，给出了针对我国现有MEMS晶圆级测试系统校准问题的初步解决方案。并指出了该类测试系统今后向着标准化模块化方向发展的趋势。
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| 关 键 词： | 微机电系统 晶圆级测试系统 测试技术 标准物质 |
Present situation and future prospect of MEMS wafer level test system |
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| QIAO Yu-e,LIU Yan,CHENG Xiao-hui,DING Li-qiang,DING Chen,LIANG Fa-guo. Present situation and future prospect of MEMS wafer level test system[J]. Transducer and Microsystem Technology, 2016, 0(10). DOI: 10.13873/J.1000-9787(2016)10-0001-03 |
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| Authors: | QIAO Yu-e LIU Yan CHENG Xiao-hui DING Li-qiang DING Chen LIANG Fa-guo |
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| Abstract: | Wide application of MEMS products makes it necessary to study on wafer level testing technology. Domestic& international present situation of hardware of MEMS wafer level test system and testing technology of MEMS wafer level are analyzed. Referring to RM8096/8097 reference material( RM),a preliminary solution for calibration problem of system is given. Trend of standardization and modularization that testing system can expand in the future is pointed out. |
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| Keywords: | MEMS wafer level test system testing technology reference material( RM) |
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