| 金刚石表面离子束金属化研究 |
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| 引用本文： | 李国卿,张家良,牟宗信,郭宝海,黄宁表,李述汤,何浩培,刘悦,刘会民,花吉珍,陈季文.金刚石表面离子束金属化研究[J].微纳电子技术,1998(5). |
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| 作者姓名： | 李国卿 张家良 牟宗信 郭宝海 黄宁表 李述汤 何浩培 刘悦 刘会民 花吉珍 陈季文 |
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| 作者单位： | 大连理工大学三束材料改性国家重点实验室，香港城市大学，电子工业部第十三研究所 |
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| 摘 要： | 采用离子束增强沉积技术对金刚石热沉材料表面金属化进行了研究，制备了Ｔｉ／Ｎｉ／ＡｕＩｎ和Ｃｕ／ＡｕＩｎ金属化体系。采用俄歇、ＥＤＳ、ＸＲＤ和ＳＣＲＡＴＣＨ方法对膜层和界面进行了分析。
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| 关 键 词： | 金刚石 表面金属化 Ti／Ni／AuIn Cu／AuIn |
Metallization of Diamond by Ion Beam Enhanced Deposition |
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| Li Guoqing,Zhang Jialiang,Mu Zongxin,Guo Baohai.Metallization of Diamond by Ion Beam Enhanced Deposition[J].Micronanoelectronic Technology,1998(5). |
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| Authors: | Li Guoqing Zhang Jialiang Mu Zongxin Guo Baohai |
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| Abstract: | The results of metallization of diamond hit sick by ion beam enhanced deposition were reported in this paper.The novel metalliszation schemes with Ti/Ni/AuIn and Cu/AuIn were developed.The surface and interface of the metallization layer were ana lysed by use of Auger,EDS,XRD and SCRATCH methods. |
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| Keywords: | Diamond Surface metallization Ti/Ni/AuIn Cu/AuIn |
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