| 室温固化耐热环氧胶粘剂的研究进展与发展趋势 |
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| 引用本文： | 王鑫,齐暑华,吴波,齐海元,李美玲. 室温固化耐热环氧胶粘剂的研究进展与发展趋势[J]. 中国胶粘剂, 2009, 18(11) |
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| 作者姓名： | 王鑫 齐暑华 吴波 齐海元 李美玲 |
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| 作者单位： | 西北工业大学理学院应用化学系,陕西西安,710072 |
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| 摘 要： | 综述了室温固化耐热环氧树脂(EP)胶粘剂的研究进展与发展趋势,介绍了近年来国内外部分性能优异的室温固化耐热EP胶粘剂,指出室温固化耐热EP胶粘剂的发展趋势是耐高温、高强度、高耐久性及快速固化。
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| 关 键 词： | 室温固化 耐热 环氧树脂 结构胶 |
Research progress and development trend of epoxy resin adhesives with room temperature curing and heat resistance |
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| WANG Xin,QI Shu-hua,WU Bo,QI Hai-yuan,LI Mei-ling. Research progress and development trend of epoxy resin adhesives with room temperature curing and heat resistance[J]. China Adhesives, 2009, 18(11) |
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| Authors: | WANG Xin QI Shu-hua WU Bo QI Hai-yuan LI Mei-ling |
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| Affiliation: | WANG Xin,QI Shu-hua,WU Bo,QI Hai-yuan,LI Mei-ling(Department of Applied Chemistry,School of Science,Northwestern Polytechnical University,Xi'an 710072,China) |
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| Abstract: | The research progress and development trend of epoxy resin(EP) adhesives with room temperature curing and heat resistance were summarized.Some EP adhesives with excellent performances were introduced at home and abroad.It is indicated that the development trend for EP adhesive with room temperature curing and heat resistance is high temperature resistance,high strength,high endured and fast curing. |
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| Keywords: | room temperature curing heat resistance epoxy resin structural adhesive |
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