金刚石化学机械抛光研究现状

金刚石由于其独特的性质成为未来科技的重要材料,但较差的表面质量会影响其在高科技领域的应用,因此实现金刚石超精密加工是提高金刚石应用的关键。化学机械抛光(CMP)是集成电路中获得全局平坦化的一项重要工艺,能够实现金刚石的超精密加工。介绍了现有的金刚石加工方法和金刚石化学机械抛光的研究现状,并与其他的加工方法(机械抛光、摩擦化学抛光、热化学抛光等)进行了对比,其他加工方法存在加工后表面损伤严重、加工表面粗糙度无法满足需要等问题。金刚石的化学机械抛光工艺经历了由高温抛光向常温抛光的发展过程,该加工方法设备简单、成本低、抛光后的表面粗糙度(Ra)可以达到亚纳米级别。此外,金刚石的分子动力学模拟(MD)使人们从原子尺度对金刚石抛光过程中纳米粒子的相互作用和抛光机理有了深入了解。虽然金刚石化学机械抛光还存在着许多亟待解决的问题,但是其发展前景依旧十分乐观。

Research Status on Chemical Mechanical Polishing of Diamond

Diamond is an important material for future technology due to its unique properties, but poor surface quality can affect its application in high-tech fields. Therefore, it is the key for diamond applications to achieve diamond ultra-precision machining. Chemical mechanical polishing (CMP) is an important process for achieve global planarization in integrated circuits, enabling diamond ultra-precision machining. The existing processing methods and CMP research status of diamond are introduced as well as the advantages and disadvantages of other processing methods (mechanical polishing, tribo-chemical polishing, thermo-chemical polishing, etc.) are compared. Other processing methods have problems, such as serious damage to the surface after processing and incomplete processing surface roughness. The CMP of diamond has undergone a development process from high-temperature polishing to room-temperature polishing. The process equipment is simple, low in cost, and the surface roughness after polishing can reach sub-nanometer level. In addition, the molecular dynamics (MD) simulation of diamond make us have an insightful understanding on the interaction of nanoparticles and polishing mechanism during diamond polishing process from atomic perspective. Although there are still many problems to be solved in diamond CMP process, its development prospects are still very optimistic.