Fabrication of RF MEMS variable capacitors by deep X-ray lithography and electroplating |
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Authors: | Sven Achenbach David Klymyshyn Darcy Haluzan Timo Mappes Garth Wells Jürgen Mohr |
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Affiliation: | (1) Forschungszentrum Karlsruhe, Institut für Mikrostrukturtechnik (IMT), Postfach 3640, 76021 Karlsruhe, Germany;(2) Department of Electrical Engineering, University of Saskatchewan, 57 Campus Drive, S7N 5A9 Saskatoon, SK, Canada;(3) TRLabs, 111-116 Research Drive, S7N 3R3 Saskatoon, SK, Canada |
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Abstract: | Radio frequency micro electro-mechanical systems (RF MEMS) vertical cantilever variable capacitors fabricated using deep X-ray
lithography and electroplating are presented. Polymethylmethacrylate (PMMA) layers of 100 μm and 150 μm have been patterned
and electroplated with 70 μm and 100 μm thick nickel. A 3 μm thick titanium layer was used as plating base as well as etch
time-controlled sacrificial layer for the release of the cantilever beam. The parallel plate layout includes narrow gaps and
cantilever beams with an aspect ratio in nickel of up to 60 for 1 mm long features. Auxiliary structures support the beams
and gaps during the processing. Room temperature electroplating significantly reduces the risk of deformations compared to
the standard process temperature of 52°C. The capacitors operate in the 1–5 GHz range, and demonstrate good RF performance,
with quality factors on the order of 170 at 1 GHz for a 1 pF capacitance. |
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Keywords: | RF MEMS Variable capacitor X-ray lithography Electroplating |
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