薄金属带材连续高速电镀异型阳极

为了提高金属带材连续高速电镀的速度、质量和降低能耗,控制金属电沉积的电流密度和阳极形状是关键.考虑到金属带材高速电镀时传输的电流大,在镀区内的金属带材不是等电势体,导致金属电沉积的电流密度分布不均匀.为此,建立了恒定电流密度电镀的数学模型,推导出异型阳极形状的计算公式,为金属带材连续高速电镀的电流密度控制提供了理论依据.

Profiled Anode for High Speed Continuous Plating on Thin Metal Strip

In order to improve the speed and quality of high speed continuous plating on thin metal strip,reduce the energy cost,it is very important to control the current density of metal electrodeposition and the geometric of the anode.Because the metal strip is not a equipotential substance,the big transmitted current is used during plating at high speed,they induce the ununiform distributing of current density of metal electrodepositing.Therefor,a mathematical model of constant current density plating was established,as well as a formula for calculating the geometric of the profiled anode,this work provided a theoretical foundation of density control in metal strip continuous high speed electrodeposition.