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| 粘结材料对TCBGA封装组件弯曲可靠性的影响 | |
| 引用本文： | 史洪宾,吴金昌,唐帆. 粘结材料对TCBGA封装组件弯曲可靠性的影响[J]. 电子元件与材料, 2010, 29(8) |
| 作者姓名： | 史洪宾 吴金昌 唐帆 |
| 作者单位： | 1. 广达上海制造城表面组装技术实验室,上海,201613;复旦大学,信息科学与工程学院,上海,200433 2. 广达上海制造城表面组装技术实验室,上海,201613 3. 汉高股份有限公司,上海,201203 |
| 摘 要： | 采用三点弯曲试验,测试了十组使用不同粘结材料及不同粘接方式的薄基板球栅阵列封装(TCBGA)组件和一组未使用粘结材料的组件的弯曲可靠性。结果表明,这些粘结材料均不同程度地提高了组件的弯曲可靠性。不同粘接方式对弯曲可靠性影响不同,其中边沿绑定粘接方式效果最佳,相对于无粘结材料,对组件所能承受的最大主应变、位移和荷载分别增加了41.73%,40.86%和37.50%。 |
| 关 键 词： | 薄基板球栅阵列封装 粘结材料 弯曲可靠性 |
Effects of adhesives on bend reliability of thin core ball grid array assembly |
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| SHI Hongbin,WU Jinchang,TANG Fan. Effects of adhesives on bend reliability of thin core ball grid array assembly[J]. Electronic Components & Materials, 2010, 29(8) | |
| Authors: | SHI Hongbin WU Jinchang TANG Fan |
| Affiliation: | SHI Hongbin1,3,WU Jinchang1,TANG Fan2(1.Quanta Shanghai Manufacturing City Surface Mount Technology Laboratory,Shanghai 201613,China,2.Henkel Company Ltd,Shanghai 201203,3.School of Information Science and Engineering,Fudan University,Shanghai 200433,China) |
| Abstract: | Three-point bend test was used to test the bend reliability of ten groups of thin core ball grid array(TCBGA) assemblies with different adhesives and different bond forms and one group assemblies without the adhesive.Results indicate that all the adhesives can improve the mechanical bend reliability of assemblies in different extents,maximum priciple strain,dislocation and load of assemblies with edge fix bond form increase by 41.73%,40.86% and 37.50% respectively,compared to assemblies without adhesives. |
| Keywords: | TCBGA adhesives bend reliability |
| 本文献已被 CNKI 万方数据 等数据库收录！ | |