| 引线键合应用中的无偏倒技术(英文) |
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| 引用本文： | HuiWang DaveDeGrappo. 引线键合应用中的无偏倒技术(英文)[J]. 电子工业专用设备, 2003, 32(5): 11-15 |
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| 作者姓名： | HuiWang DaveDeGrappo |
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| 作者单位： | Kulicke & Soffa Industries,2101 Blair Mill Road, Willow Grove, Pennsylvania 19090,USA |
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| 摘 要： | 无偏倒技术(NoSWEEP)是引线成型工艺过程中防止引线偏倒或偏斜的一种工艺技术。该工艺技术包含独特的材料、设备和工艺,提供了当前生产工艺便于实施的有效方法。
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| 关 键 词： | 引线键合 无偏倒技术 偏斜 应用 |
| 文章编号： | 1004-4507(2003)05-0011-05 |
| 修稿时间： | 2003-07-28 |
NoSWEEP Technology for Wire bonding Applications |
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| Hui Wang,Dave DeGrappo. NoSWEEP Technology for Wire bonding Applications[J]. Equipment for Electronic Products Marufacturing, 2003, 32(5): 11-15 |
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| Authors: | Hui Wang Dave DeGrappo |
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| Abstract: | NoSWEEP is a technology to prevent wire sweep and/or sway during molding process. Thistechnology includes unique material, equipment and process to provide cost-effective method which can beeasily implemented on current production process. |
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| Keywords: | Wire bonding NoSWEEP Sway Application |
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