| 混合电路基板与外壳的共晶焊技术 |
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| 引用本文： | 侯一雪,乔海灵,廖智利. 混合电路基板与外壳的共晶焊技术[J]. 电子与封装, 2007, 7(8): 9-10,20 |
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| 作者姓名： | 侯一雪 乔海灵 廖智利 |
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| 作者单位： | 中国电子科技集团公司第二研究所,太原,030024;中国电子科技集团公司第二研究所,太原,030024;中国电子科技集团公司第二研究所,太原,030024 |
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| 摘 要： | 文章简要介绍了混合电路基板与外壳共晶焊的几个关键工艺步骤,其中包括共晶焊设备的选用、焊料的选择、夹具的设计制作、共晶温度曲线的设置以及共晶实验等。文章对实现多芯片共晶同样具有一定的指导意义。
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| 关 键 词： | 混合电路 基板 共晶 微组装 |
| 文章编号： | 1681-1070（2007）08-0009-02 |
| 修稿时间： | 2007-05-11 |
Eutectic Solder Technology of Hybrid Circuit Substrate and Package |
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| HOU Yi-xue,QIAO Hai-ling,LIAO Zhi-li. Eutectic Solder Technology of Hybrid Circuit Substrate and Package[J]. Electronics & Packaging, 2007, 7(8): 9-10,20 |
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| Authors: | HOU Yi-xue QIAO Hai-ling LIAO Zhi-li |
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| Affiliation: | China Electronics Technology Group Corporation No,2 Reserch Institue, Taiyuan 030024, China |
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| Abstract: | This article introduces briefly the key steps about eutectic technology in the hybrid circuit packaging. Includes the choosing of eutectic equipment and solders,fixture's design and precission manufacture,temperature prefile's setting and process experimentation.The process has a certain extent instruction in achieving multichip Eutectic. |
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| Keywords: | hybrid circuit substrate eutectic micropackage |
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