| FCOB器件在热循环载荷下的界面层裂研究 |
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| 引用本文： | 苏喜然,杨道国,赵鹏,郭丹. FCOB器件在热循环载荷下的界面层裂研究[J]. 电子元件与材料, 2008, 27(1): 62-64 |
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| 作者姓名： | 苏喜然 杨道国 赵鹏 郭丹 |
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| 作者单位： | 桂林电子科技大学,机电工程学院,广西,桂林,541004;桂林电子科技大学,机电工程学院,广西,桂林,541004;桂林电子科技大学,机电工程学院,广西,桂林,541004;桂林电子科技大学,机电工程学院,广西,桂林,541004 |
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| 摘 要： | 界面层裂是塑封半导体器件的主要失效模式之一。采用通用有限元软件MSC.MARC,研究了FCOB(基板倒装焊)器件在热循环(–55~+125℃)载荷作用下,底充胶与芯片界面的层裂问题。结果表明:底充胶与芯片界面最易出现分层,分层扩展的位置都在该界面的边缘拐角处;如果分层导致底充胶开裂,开裂的方向大约是35°。
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| 关 键 词： | 电子技术 基板倒装焊器件 底充胶 热循环 界面层裂 |
| 文章编号： | 1001-2028（2008）01-0062-03 |
| 收稿时间： | 2007-08-17 |
| 修稿时间： | 2007-08-17 |
Study on interfacial delamination of FCOB under thermal cycle loading |
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| SU Xi-ran,YANG Dao-guo,ZHAO Peng,GUO Dan. Study on interfacial delamination of FCOB under thermal cycle loading[J]. Electronic Components & Materials, 2008, 27(1): 62-64 |
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| Authors: | SU Xi-ran YANG Dao-guo ZHAO Peng GUO Dan |
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| Affiliation: | SU Xi-ran,YANG Dao-guo,ZHAO Peng,GUO Dan(Dept of Mechanical & Electronic Engineering,Guilin University of Electronic Technology,Guilin 541004,Guangxi Zhuangzu Zizhiqu,China) |
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| Abstract: | Interface delamination is one of the major failure mode in plastic IC packages.Delamination at the underfill/chip interface in a flip chip on board(FCOB) assembly was investigated through MSC.MARC software under a thermal cycle(–55~+125 ℃) loading.The results show that the potential sites of delamination and propagation of delamination at the underfill/chip interface are the fringe corner of this interface.Besides,it is also found from simulation that once underfill cracking is induced by the delamination,the cracking is about along the direction of 35°. |
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| Keywords: | electron technology FCOB device underfill thermal cycle interfacial delamination |
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