正矢波激励下简支印制电路板的跌落响应研究

对印刷电路板(PCB)的跌落响应进行了研究,将一对边固定一对边自由的电路板简化为简支梁,建立了其在正矢波脉冲激励下的动力学模型。利用SY11-100气压驱动垂直冲击试验台搭建跌落试验,测得电路板跌落时的脉冲激励以及电路板中心位置的加速度响应,通过与试验结果的对比验证所建动力学模型的正确性。在此基础上,对正矢波脉冲激励的周期以及PCB的材料结构属性对跌落冲击产生的最大应力的影响进行了分析。计算结果表明,电路板跌落冲击产生的最大应力以及达到最大应力所需的时间都与正矢波脉冲激励周期成正比,与材料结构参数λ成反比。

Dropping response of simple supported PCB under versine stimulation

Dropping impact response of PCB is studied in this work. The PCB is simplified as a simple supported beam and the dynamic model of the PCB under versine stimulation was also proposed. To validate the dynamic model,a dropping experiment was performed by SY11-100 vertical impact testing station. The pulse excitation and the acceleration response of the PCB were measured to compare with the result of the theoretical calculation. It is found that the period of the versine pulse stimulation and the material of the PCB have great influences on the dynamic response of the PCB. The results show that: the time to reach the maximum stress and the maximum stress of the PCB are both reduced as the period of the versine pulse becomes short and the material structure factor λ increases.