| 玻璃–氧化硅复合基板材料的制备及性能 |
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| 引用本文： | 汤涛,张其土,许仲梓.玻璃–氧化硅复合基板材料的制备及性能[J].电子元件与材料,2006,25(9):46-48. |
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| 作者姓名： | 汤涛 张其土 许仲梓 |
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| 作者单位： | 南京工业大学材料科学与工程学院,江苏,南京,210009 |
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| 基金项目： | 江苏省高校自然科学基金 |
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| 摘 要： | 以低相对介电常数的硼硅酸盐玻璃粉末和氧化硅粉末为原料,制备了玻璃–氧化硅复合材料。研究了烧结温度和氧化硅含量对复合材料的电学性能和力学性能的影响。结果表明,当氧化硅质量分数为45%时,玻璃–氧化硅复合材料经840℃、2h的烧结后,其εr为3.8,tanδ为4×10–4,ρv为9.8×1011?·cm,抗弯强度σ为30MPa。另外,该复合材料在100~500℃之间的热膨胀系数为(8.0~10.0)×10–6℃–1。
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| 关 键 词： | 无机非金属材料 玻璃 氧化硅 基板 介电性能 力学性能 |
| 文章编号： | 1001-2028（2006）09-0046-03 |
| 收稿时间： | 2006-05-19 |
| 修稿时间： | 2006-05-19 |
Preparation and Properties of Glass-silica Composite Substrate |
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| TANG Tao,ZHANG Qi-tu,XU Zhong-zi.Preparation and Properties of Glass-silica Composite Substrate[J].Electronic Components & Materials,2006,25(9):46-48. |
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| Authors: | TANG Tao ZHANG Qi-tu XU Zhong-zi |
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| Abstract: | The glass-silica composite materials were prepared, using borosilicate glass powder with low dielectric constant and silica powder as starting materials. The effects of the sintering temperature and the silica content on the electrical and mechanical properties were studied. The results show that when the silica content is 45 %, εr reaches 3.8, tan δ reaches 4×10–4, the volume resistivity reaches 9.8×1011 ?·cm and the bending strength reaches 30 MPa after the glass-silica composite materials are sintered for 2 h at the temperature of 840 ℃. The thermal expand coefficient of the composite material is (8.0~10.0)×10–6 ℃–1 in the temperature range of 100~500 ℃. |
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| Keywords: | inorganic non-metallic materials glass silica substrate dielectric properties mechanical properties |
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