Galvanostatic and microscopic studies of nodulation during copper electrolysis |
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Authors: | A-M. Lafront B. Veilleux E. Ghali |
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Affiliation: | (1) Department of Mining and Metallurgy, Laval University, Sainte-Foy, Quebec, G1K 7P4, Canada |
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Abstract: | The galvanostatic technique on a laboratory scale has been shown to be a useful tool in detecting the presence of nodules on the cathode during copper electrodeposition by using the value of the starting electrolytic potential and by the presence of a cathodic polarization peak on the potential–time curve. Studying the morphology of the deposit with a scanning electron microscope at various magnifications confirmed the galvanostatic results. It is postulated that inappropriate concentrations and/or ratios of the additives (thiourea, gelatin and chloride ions) are associated with a certain current density that generates intergranular microcracks due to adsorption of the additives and leads to the formation of nodules at the macroscale. |
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Keywords: | chloride additive copper nodulation and refining galvanostatic glue thiourea |
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