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Galvanostatic and microscopic studies of nodulation during copper electrolysis
Authors:A-M. Lafront  B. Veilleux  E. Ghali
Affiliation:(1) Department of Mining and Metallurgy, Laval University, Sainte-Foy, Quebec, G1K 7P4, Canada
Abstract:The galvanostatic technique on a laboratory scale has been shown to be a useful tool in detecting the presence of nodules on the cathode during copper electrodeposition by using the value of the starting electrolytic potential and by the presence of a cathodic polarization peak on the potential–time curve. Studying the morphology of the deposit with a scanning electron microscope at various magnifications confirmed the galvanostatic results. It is postulated that inappropriate concentrations and/or ratios of the additives (thiourea, gelatin and chloride ions) are associated with a certain current density that generates intergranular microcracks due to adsorption of the additives and leads to the formation of nodules at the macroscale.
Keywords:chloride additive  copper nodulation and refining  galvanostatic  glue  thiourea
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