Microstructure Characterization and Creep Behavior of Pb-Free Sn-Rich Solder Alloys: Part I. Microstructure Characterization of Bulk Solder and Solder/Copper Joints
(1) School of Materials, Fulton School of Engineering, Arizona State University, Tempe, AZ 85287-8706, USA;(2) Present address: Assembly Technology Development Department, Intel Corporation, Chandler, AZ, USA