电子陶瓷和器件的低温共烧技术

较系统地介绍了电子器件用低温共烧陶瓷(low temperature cofired ceramics,LTCCs)材料,探讨了其工艺中的若干问题。电子器件用低温共烧陶瓷材料包括:玻璃/陶瓷复合材料、结晶化玻璃、晶化玻璃/陶瓷复合材料以及液相烧结陶瓷,其中典型的和最为常用的LTCCs为玻璃/陶瓷(特别是氧化铝)复合材料。正在研究的一些陶瓷介质材料中,Bi基介质材料引起了人们的关注。玻璃/陶瓷复合材料的制备工艺中,应当着重关注和加深了解玻璃的流动性和结晶性、玻璃的起泡、玻璃和陶瓷颗粒间的反应、共烧材料的匹配等问题,从优选材料配方和优化工艺着手,从而获得优质可靠的材质和器件。

LOW TEMPERATURE COFIRING TECHNIQUE FOR ELECTRONIC CERAMICS AND DEVICE

Low temperature cofired ceramics (LTCCs) used in electronic devices and some problems in the process for producing LTCCs are introduced systematically.LTCCs include glass/ceramic composites,crystallized glass,crystallized glass/ceramic composites and liquid-phase sintered ceramics.Among them,the composites of glass and ceramics (especially alumina) are most commonly used for LTCCs.Current research has focused on Bi-based dielectric materials.In the preparation process for glass/ceramic composites,we must pay close attention to the fluidity and crystallization of glass,the foaming of glass,the reaction between the particles of glass and ceramic and the mismatch between cofired metal and ceramic materials.We must also study and choose the composition and type of materials,and the optimum processing conditions,in order to obtain reliable and high quality ceramic materials and devices.