| THERMAL SHOCK FATIGUE BEHAVIORS OF CEMENTED CARBIDE YG20 |
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| 引用本文： | Liu Ning,Xu Genying,Xu Yudong Department of Materials Science and Engineering,Anhui Institute of Technology,Hefei 230069 Li Jian Research Institute of Machinery Science and Technology,Beijing 100044. THERMAL SHOCK FATIGUE BEHAVIORS OF CEMENTED CARBIDE YG20[J]. 中国有色金属学会会刊, 1997, 0(2) |
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| 作者姓名： | Liu Ning Xu Genying Xu Yudong Department of Materials Science and Engineering Anhui Institute of Technology Hefei 230069 Li Jian Research Institute of Machinery Science and Technology Beijing 100044 |
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| 作者单位： | Liu Ning，Xu Genying，Xu Yudong Department of Materials Science and Engineering，Anhui Institute of Technology，Hefei 230069 Li Jian Research Institute of Machinery Science and Technology，Beijing 100044 |
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| 摘 要： | ＴＨＥＲＭＡＬＳＨＯＣＫＦＡＴＩＧＵＥＢＥＨＡＶＩＯＲＳＯＦＣＥＭＥＮＴＥＤＣＡＲＢＩＤＥＹＧ２０①ＬｉｕＮｉｎｇ，ＸｕＧｅｎｙｉｎｇ，ＸｕＹｕｄｏｎｇＤｅｐａｒｔｍｅｎｔｏｆＭａｔｅｒｉａｌｓＳｃｉｅｎｃｅａｎｄＥｎｇｉｎｅｒｉｎｇ，ＡｎｈｕｉＩｎ...
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THERMAL SHOCK FATIGUE BEHAVIORS OF CEMENTED CARBIDE YG20 |
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| Liu Ning,Xu Genying,Xu Yudong. THERMAL SHOCK FATIGUE BEHAVIORS OF CEMENTED CARBIDE YG20[J]. Transactions of Nonferrous Metals Society of China, 1997, 0(2) |
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| Authors: | Liu Ning Xu Genying Xu Yudong |
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| Affiliation: | Liu Ning,Xu Genying,Xu Yudong Department of Materials Science and Engineering,Anhui Institute of Technology,Hefei 230069 Li Jian Research Institute of Machinery Science and Technology,Beijing 100044 |
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| Abstract: | The thermal shock fatigue behaviors of cemented carbide YG20 have been studied. The results show that the formation of thermal shock fatigue cracks is related to nucleation, growth and aggregation of microvoids distributed at the interfaces of WC/Co phases. The incubation period of crack formation decreases and the propagation rate of crack increases with increasing of the cyclic temperature and cooling rate in the cycles. The notch also has the same effect. The SEM examination has also denoted that there are some fatigue striae on the fracture morphologies of fracture surfaces. |
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| Keywords: | cemented carbide YG20 thermal shock fatigue crack formation microvoid |
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