| 不流动（低流动度）半固化片及其在刚挠性板和冷板中的应用 |
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| 引用本文： | 李海. 不流动（低流动度）半固化片及其在刚挠性板和冷板中的应用[J]. 印制电路信息, 2005, 0(12): 52-54 |
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| 作者姓名： | 李海 |
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| 摘 要： | 介绍了什么是不流动(低流动度)半固化片,以及在PCB行业中的主要应用,特别介绍了在加工挠性板和冷板的工艺注意事项。并通过丰富的图示,介绍了其测试方法,通过玻璃转化温度,导热特性等多方面介绍了不流动(低流动度)半固化片的选择方法。
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| 关 键 词： | 低流动度 刚—挠性板 冷(散热)板 |
No-flow Prepreg (Low Flow Prepreg) and It''''s Application in Rigid-flex and Heat Sink |
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| Peter Ni. No-flow Prepreg (Low Flow Prepreg) and It''''s Application in Rigid-flex and Heat Sink[J]. Printed Circuit Information, 2005, 0(12): 52-54 |
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| Authors: | Peter Ni |
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| Abstract: | With this article,Low-flow prepreg is introduced in this article,and the application in Rigid-flex and heatsink,with data and graphic,test method of no-flow pp and process issues are introduced here.This article also gives you a guidance of how to choose No-flow. |
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| Keywords: | low-flew rigid-flex boord heatsink |
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