| 低温共烧陶瓷基板的薄膜金属化 |
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| 引用本文： | 吴申立.低温共烧陶瓷基板的薄膜金属化[J].电子元件与材料,2001,20(6):13-14. |
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| 作者姓名： | 吴申立 |
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| 作者单位： | 信息产业部电子第43研究所, |
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| 摘 要： | 就低温共烧陶瓷(LTCC)基板实用化过程中遇到的问题,研究了LTCC基板的薄膜金属化技术;经复合膜系Ti/Ni/Au薄膜金属化的LTCC基板可满足各项技术指标要求,通过考核证明了用此方法制得的基板可靠性高,完全满足使用要求。
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| 关 键 词： | 低温共烧陶瓷 薄膜金属化 磁控溅射 |
| 文章编号： | 1001-2028(2001)06-0013-02 |
Thin-film Metalization on LTCC Substrates |
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| WU Shen-li.Thin-film Metalization on LTCC Substrates[J].Electronic Components & Materials,2001,20(6):13-14. |
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| Authors: | WU Shen-li |
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| Abstract: | The technologies to put into LTCC substrate into practical use, the technology for thin-film metalization on LTCC substrates is researched. The experimental results show that Ti/Ni/Au thin-film metalization on the substrates can completely meet the technical requirements. And the test results show that the substrates obtained this way possess very high reliability and feasible for practical use. |
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| Keywords: | low temperature co-fired ceramics thin-film metalization magnetron sputtering |
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