| 微波器件金属陶瓷外壳电性能设计及实践——微波器件封装之一 |
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| 引用本文： | 高尚通,王文琴. 微波器件金属陶瓷外壳电性能设计及实践——微波器件封装之一[J]. 半导体技术, 2002, 27(11): 51-54. DOI: 10.3969/j.issn.1003-353X.2002.11.016 |
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| 作者姓名： | 高尚通 王文琴 |
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| 作者单位： | 中电科技集团电子13所,河北,石家庄,050051 |
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| 摘 要： | 总结了微波器件金属陶瓷外壳的电性能设计理论和实践成果,给出了研制微波器件金属陶瓷外壳的基本流程及设计要素;详细介绍了用于微波器件外壳设计时电容、电感、特性阻抗、延迟等参数的计算公式;根据多年的实践经验,给出了几种行之有效的改善外壳电性能的结构和模式;最后就技改项目、研究装备、外壳所需的基础材料的研究开发和生产、高新技术产业化等问题提出了建议.
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| 关 键 词： | 多层陶瓷 金属-陶瓷封装 微波器件 |
| 文章编号： | 1003-353X(2002)11-0051-04 |
Electrical performance design and practice of metal-ceramic packages for microwave devices |
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| GAO Shang-tong,WANG Wen-qin. Electrical performance design and practice of metal-ceramic packages for microwave devices[J]. Semiconductor Technology, 2002, 27(11): 51-54. DOI: 10.3969/j.issn.1003-353X.2002.11.016 |
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| Authors: | GAO Shang-tong WANG Wen-qin |
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| Abstract: | Theory of electrical performance design and practice of metal-ceramic packages aresummarized in this paper. The fundamental process and design essentialities are given, the formulasusing in calculating the parameters are introduced in detail. From years of experiences, some effec-tive ways which can improve the electrical performance are given, and some suggestions for devel-oping this kind of package are also mentioned. |
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| Keywords: | multi-layer ceramic metal-ceramic package microwave device |
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