首页 | 本学科首页   官方微博 | 高级检索  
     

Fabrication and thermal performance of grooved-sintered wick heat pipe
引用本文:JIANG Le-lun,TANG Yong,WU Hui-yue,ZHOU Wei,JIANG Lin-zhen. Fabrication and thermal performance of grooved-sintered wick heat pipe[J]. 中南工业大学学报(英文版), 2014, 0(2): 668-676
作者姓名:JIANG Le-lun  TANG Yong  WU Hui-yue  ZHOU Wei  JIANG Lin-zhen
基金项目:Project(51205423)supported by the National Natural Science Foundation of China;Project(2012M510205)supported by China Postdoctoral Science Foundation;Project(S2012040007715)supported by Natural Science Foundation of Guangdong Province,China;Project(20120171120036)supported by New Teachers’Fund for Doctor Stations,Ministry of Education,China
摘    要:Some novel grooved-sintered composite wick heat pipes(GSHP) were developed for the electronic device cooling.The grooved-sintered wicks of GSHP were fabricated by the processes of oil-filled high-speed spin forming and solid state sintering.The wick could be divided into two parts for liquid capillary pumping flow:groove sintered zone and uniform sintered zone.Both of the thermal resistance network model and the maximum heat transfer capability model of GSHP were built.Compared with the theoretical values,the heat transfer limit and thermal resistance of GSHP were measured from three aspects:copper powder size,wick thickness and number of micro grooves.The results show that the wick thickness has the greatest effect on the thermal resistance of GSHP while the copper powder size has the most important influence on the heat transfer limit.Given certain copper powder size and wick thickness,the thermal resistance of GSHP can be the lowest when micro-groove number is about 55.

关 键 词:固相烧结  散热性能  制造  热管  地源热泵  沟槽  电阻网络模型  传热极限

Fabrication and thermal performance of grooved-sintered wick heat pipe
Affiliation:[1]School of Engineering, Sun Yat-sen University, Guangzhou 510006, China; [2]Key Laboratory of Surface Functional Structure Manufacturing of Guangdong Higher Education Institutes (South China University of Technology), Guangzhou 510640, China; [3]School of Communication and Design, Sun Yat-sen University, Guangzhou 510006, China; [4]School of Foreign Studies, Yiwu Industrial and Commercial College, Yiwu 322000, China
Abstract:wick heat pipe electronics cooling thermal resistance heat transfer limit
Keywords:wick  heat pipe  electronics cooling  thermal resistance  heat transfer limit
本文献已被 CNKI 维普 等数据库收录!
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号