| 晶圆叠层3D封装中晶圆键合技术的应用 |
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| 引用本文： | 田芳. 晶圆叠层3D封装中晶圆键合技术的应用[J]. 电子工业专用设备, 2013, 42(1): 5-7,42 |
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| 作者姓名： | 田芳 |
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| 作者单位： | 中国电子科技集团公司第二研究所,山西太原,030024 |
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| 摘 要： | 论述了晶圆叠层3D封装中的典型工艺——晶圆键合技术,并从晶圆键合原理、工艺过程、键合方法、设备要求等方面对其进行了深入探讨;以期晶圆叠层3D封装能够应用到更加广泛的领域。
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| 关 键 词： | 晶圆叠层 3D封装 键合 |
Application of Wafer Bonding Technology in Wafer on Wafer 3D Package |
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| TIAN Fang. Application of Wafer Bonding Technology in Wafer on Wafer 3D Package[J]. Equipment for Electronic Products Marufacturing, 2013, 42(1): 5-7,42 |
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| Authors: | TIAN Fang |
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| Affiliation: | TIAN Fang (No.2 Research Institute of CETC,Taiyuan 030024,China) |
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| Abstract: | Wafer bonding technology has be discussed which is the typical technology of wafer on wafer 3D packag. Article discussed Bonding principle, equipment demand, bonding process and method, etc. Wafer on wafer 3-D package will have more application in future. |
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| Keywords: | wafer on wafer 3D package bonding |
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