| 表面组装工艺系统可靠性研究 |
| |
| 引用本文： | 曾成,赵锡均,黄萍,董义,胡斌.表面组装工艺系统可靠性研究[J].电子质量,2010(2):44-45. |
| |
| 作者姓名： | 曾成 赵锡均 黄萍 董义 胡斌 |
| |
| 作者单位： | 中国工程物珲研究院电子工程研究所,四川,绵阳,621900 |
| |
| 摘 要： | 文章提出了表面组装工艺系统可靠性的概念，介绍了工艺系统可靠性指标，提出了表面组装工艺系统可靠性建模方法。
|
| 关 键 词： | 表面组装 工艺系统 可靠性 |
Surface Mount Technology System Reliability Study |
| |
| Zeng Cheng,Zhao Xi-jun,Huang Ping,Dong Yi,Hu Bin.Surface Mount Technology System Reliability Study[J].Electronics Quality,2010(2):44-45. |
| |
| Authors: | Zeng Cheng Zhao Xi-jun Huang Ping Dong Yi Hu Bin |
| |
| Affiliation: | Electronic Engineering Research Institute;CAEP;Sichuan Mianyang 621900 |
| |
| Abstract: | This paper proposed surface mount technology asystem reliability concepts,introduced the technology system reliability index and proposed surface mount technology system reliability modeling method. |
| |
| Keywords: | SMT process system Reliability |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
