| Abstract: | One of the most promising approaches in modern microelectronics is the introduction of 3D chip micro systems with through-silicon via (TSV) interconnections. A successful transfer of this technology from the scientific level up to the level of mass production is not least of all a matter of cost-effectiveness and profit, which is directly related to high productivity. The developed technologies therefore have to be feasible for effective mass production. In this paper we introduce a method for planning and evaluating costs in future process chains. This method goes beyond usual mostly Excel-supported solutions, as it is based on a discrete event simulation system. The simulation model is generically generated out of an XML process chain definition file and includes a sophisticated state model for machines. Multiple process scenarios are created with the help of a supporting software tool. These scenarios are investigated for achieving favourable equipment and process chain configurations as well as control strategies to support manufacturing ramp-ups. |
