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IC封测企业管理评价模式之探讨
引用本文:王义贤.IC封测企业管理评价模式之探讨[J].电子与封装,2008,8(3):43-46.
作者姓名:王义贤
作者单位:华越芯装电子股份有限公司,浙江绍兴,312000
摘    要:文章介绍了封装测试业在国内呈蓬勃发展之势的情况下,2006年国内集成电路封装测试企业达70家,有实力的外资、合资、中资(国有改制、股份制)封装企业都相对集中在长江三角洲一带,中低端封装产能过剩,行业竞争态势日益加剧阐述了封装测试企业进行精细的成本管理、严格的质量管理、先进的制造管理的重要性和必要性。并借鉴国际先进封装测试企业的制造管理模型和平时的管理心得,归纳整理出一个评价封装测试企业的管理模型。

关 键 词:生产绩效  成本绩效  品质绩效  焊线机的绩效指标  塑封机的绩效指标  焊线机和塑封机的影响因素

Discussing Assessment Pattern for IC Packaging & Testing Enterprises' Management
WANG Yi-xian.Discussing Assessment Pattern for IC Packaging & Testing Enterprises'' Management[J].Electronics & Packaging,2008,8(3):43-46.
Authors:WANG Yi-xian
Affiliation:WANGYi-xian ( ZheJiang HuaYue Chip-packaging Electronics Co., Shaoxing 312000, China )
Abstract:With the development of semiconductor manufacturing industry in domestic, more and more IC packaging & testing enterprises appear in china lead to more and more competition in this field, and therefore current situation is difficult for miniature enterprises. It is the key to an IC packaging & testing enterprise’s success that whether it’s management is appropriate or not. This thesis meets this requirement, it illustrates the importance of accurately calculating capital, strictly controlling quality and advanced manufacturing manage-ment to the enterprise’s management. By referring to advanced international IC enterprises’ manufacturing management pattern, and combining with the author’s own managerial experience, the author summs up a mode to assess an IC packaging & testing enterprise’s management from the above three aspects.
Keywords:manufacturing performance  capital performance  quality performance  index of wire bonding ma-chine performance  index of molding machine performance  influence factors of wire bonding machine and molding machine
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