| 再流焊工艺中表面组装片式元件热传输特性模拟 |
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| 引用本文： | 杜磊,孙承永.再流焊工艺中表面组装片式元件热传输特性模拟[J].电子元件与材料,1995,14(1):13-19. |
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| 作者姓名： | 杜磊 孙承永 |
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| 作者单位： | 西安电子科技大学 |
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| 摘 要： | 采用有限元数值计算方法，对表面组装件的典型结构进行了对流再流焊的瞬态热模拟，以清晰、直观的等温线图描绘了再流焊各阶段温度的分布，可定量地了解表面组装件热传输特性。本方法可用于ＳＭＴ再流焊工艺（温度曲线）的优化和温度曲线的计算机辅助设计，有助于提高ＳＭＴ的成品率与产品的可靠性。
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| 关 键 词： | 表面组装技术，再流焊，片式元件，热传输特性，计算机模拟 |
Modeling of Heat Transfer in the Surface Mounting of Electronic Components During Reflow Process |
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| Du Lei, Sun Chengyong, Bao Junling.Modeling of Heat Transfer in the Surface Mounting of Electronic Components During Reflow Process[J].Electronic Components & Materials,1995,14(1):13-19. |
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| Authors: | Du Lei Sun Chengyong Bao Junling |
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| Affiliation: | Du Lei; Sun Chengyong; Bao Junling |
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| Abstract: | Transient heat transfer during conrection reflow process in typical structure of surface mount devices (SMD) is modelled with the help of finite element numerical analysis. The temperature distribution in reflow stages is discribed by direct and clear isothermal gpaph , through which the heat transfer in SMD can be understood quantitalively. This method can be used for optimization of SMT reflow technology ( temperature curves) and CAD of the temperature curves and promotes enhancement of rate of qualified SMDs and their reliability. |
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| Keywords: | surface mounting technology reflow chip component heat transfer computer modehing |
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