| 集成电路封装的发展与展望 |
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| 引用本文： | 郑志荣. 集成电路封装的发展与展望[J]. 微电子技术, 2002, 30(3): 1-5 |
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| 作者姓名： | 郑志荣 |
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| 作者单位： | 中国华晶电子集团公司,江苏,无锡,214061 |
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| 摘 要： | 本文结合了集成电路技术的进步，通过对集成电路封装发展的探索，找出了其中的关键步骤，提出了发展中的内外因素，摸索其规律，并作出了封装今后发展趋势的设想。
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| 关 键 词： | 集成电路 IC 集成电路封装 表面组装技术 SMT |
| 文章编号： | 1008-0147(2002)03-01-05 |
| 修稿时间： | 2001-11-26 |
On Development and Prospect of IC Package |
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| ZHENG Zhi rong. On Development and Prospect of IC Package[J]. Microelectronic Technology, 2002, 30(3): 1-5 |
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| Authors: | ZHENG Zhi rong |
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| Abstract: | Based on the progress of technology in IC and the development of IC package,the key steps of IC package,as well as the rules of developing are found out by means of consideration of internal and external factors.In adition,a suggestion how to posh the development of IC package in the future is presented. |
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| Keywords: | IC IC package Surface mount techinology(SMT) |
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