| 化学镀在陶瓷散热片焊接上的应用 |
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| 引用本文： | 许耀生,肖耀坤.化学镀在陶瓷散热片焊接上的应用[J].电镀与涂饰,1995,14(3):34-35. |
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| 作者姓名： | 许耀生 肖耀坤 |
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| 作者单位： | 电子工业部第七研究所 |
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| 摘 要： | 电台用的电子部件如大功率晶体管等与陶瓷散热片焊接时，锡与银会共熔，银层从散热片上脱落，利用光学镀镍作阻挡层，化学镀金作可焊层，可得到良好的焊接效果。
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| 关 键 词： | 化学镀 镀层 焊锡 镀金 镀银 电镀 |
Electroless Plating for Soldering of Ceramic Radiating Fins |
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| XU Yaosheng,XIAO Yaokun,GUAN Xiaojie.Electroless Plating for Soldering of Ceramic Radiating Fins[J].Electroplating & Finishing,1995,14(3):34-35. |
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| Authors: | XU Yaosheng XIAO Yaokun GUAN Xiaojie |
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| Affiliation: | XU Yaosheng;XIAO Yaokun;GUAN Xiaojie |
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| Abstract: | When soldering ceramic radiating fins on electronic component such as powerful transistors for radio station, the silver film on the fins would be melted together with the tin solder and broken down. Good soldering result may be obtained by applying electroless nickel as barrier layer and electroless gold as top layer to provide solderability. |
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| Keywords: | electroless plating nickel deposit gold deposit soldering |
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