Improving low-temperature APCVD SiO2 passivation byrapid thermal annealing for Si devices

The quality of low-temperature (≈400°C) atmospheric pressure chemical vapor deposited (APCVD) silicon dioxide (SiO₂ ) films has been improved by a short time rapid thermal annealing (RTA) step. The RTA step followed by a low temperature (400°C) forming gas anneal (FGA) results in a well-passivated Si-SiO₂ interface, comparable to thermally grown conventional oxides. Efficient and stable surface passivation is obtained by this technique on virgin silicon as well as on photovoltaic devices with diffused (n⁺p) emitter surface while maintaining a very low thermal budget. Device parameters are improved by this APCVD/RTA/FGA passivation process