研究UV-LIGA微电铸电极过程的交流阻抗法

在给定的电铸液组分和工艺路线下,运用交流阻抗法研究了微电铸镍结构的电极过程动力学特性。建立了微电铸体系的等效电路,根据实验获得的交流阻抗图和电阻电抗频率响应,分析了搅拌、整平剂对微电铸体系交流阻抗的影响,计算了电极过程的交换电流密度。结果表明,加入十二烷基硫酸钠整平剂数量存在一个使交流阻抗最小的最佳值,大小为3 g/L,在有搅拌、加入最佳量的整平剂时,体系电极过程的交换电流密度为0.171 A/dm²。在微电铸过程中有搅拌、加入适量整平剂使电铸液交流阻抗下降,阴极电流效率提高,可以改善微电铸镍结构的表面性能、致密度和高度均匀性。

Study on electrode process of UV-LIGA micro-electroforming by AC impedance method

In order to find out basis factors related with metal electrocrystallization of cathode and to take adequate measures to control electrode process of cathode,the electrode process kinetics of micro-electroforming was studied.Under provided composition of electroforming solution and technology course conditions,the electrode process kinetics of micro-electroforming Ni structure was studied by AC impedance method.The equivalent circuit of micro-electroforming system was presented.Then, the influence of agitation and leveling agent on impedance of electroforming system was analyzed based on AC impedance chart and resistance reactance frequency response.Finally,the kinetic parameter,exchange current density in electrode process was calculated.The results show that the optimization amount of leveling agent is 3 g/L by measuring impedance of solution,exchange current density is 0.171 A/dm2 under agitation and optimization amount of leveling agent conditions.The impedance of solution is decreased,and the current efficiency of cathode is increased while agitating micro-electroforming solution and using leveling agent,it can improve surface performance,tightness and uniformity of Ni microstructure.