NUMERICAL SIMULATION OF THE TEMPERATURE FIELD IN A SOLDER BALL UNDER PULSED LASER AND ITS EFFECT ON THE VIBRATION OF THE SOLDER |
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| Authors: | C. Q. Wang M. Y. Li L. Fang |
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| Affiliation: | C. Q. Wang,M. Y. Li and L. Fang (National Key Laboratory of Advanced Welding Production Technology,H. I. T.,Harbin,China) |
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| Abstract: | The research presented here is focused on the vibration condition of a small volume solder solder ball,which is placed on the surface of a soldering pad and is exerted a pulse modulated continuous wave laser heat source. Finite element method is applied to analyzed the temperature field in the solder ball, and experi- ment is conducted to test the vibration. the results show that,that, the temperature field flucturates with the same frequency as that of the laser pulse, which in turn causes a forced vibration of the same frequency in the liquid solder ball. |
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| Keywords: | pulse modulated continuous wave laser finite element analysis forced vibration |
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