| Abstract: | Advanced hydrometallurgical separation processes are gaining significant importance for the recovery of gold from the aqueous solutions viz. leach liquor of waste electronics, plating material solutions, and waste wash water from electronic industries. In the present investigation, gold adsorption from the waste rinse water of semiconductor manufacturing industries is reported using Amberlite XAD-7HP. For experimental purposes, chloride waste rinse water that contained primarily Au (281 mg/ L) with trace amounts of Cu, Ni, Zn, Sn etc was used. Batch studies were carried out to optimize various process parameters, including contact time, acidity of solution, and resin dosage for the adsorption of gold from the above waste effluent. Adsorption of 92.25% gold was found from the waste solution within a contact time of 30 minutes at an aqueous to resin (A/R) ratio of 25 mL/g and an equilibrium pH of 0.63. In optimal conditions, the loading capacity of resin for gold was observed to be 58.82 mg of gold/g of resin. The gold adsorption phenomena were confirmed by the comparative FT-IR spectroscopic characterization studies of fresh resin and gold loaded resin. Elution tests were carried out for the elution of gold from the gold loaded resin using various ratio mixtures of acetone and 1.0 M HCl. An elution efficiency of 96.96% gold was achieved at an acetone-to-acid ratio of 9. In this condition, gold-enriched solution containing 7,240 mg gold/ L was obtained. The maximum elution of gold was found to be 99.33% using pure acetone in a contact time of 30 minutes. The data obtained will be useful to simulate the continuous gold adsorption process within a column. |
