| 激光直写布线技术的现状与展望 |
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| 引用本文： | 刘敬伟 曾晓雁. 激光直写布线技术的现状与展望[J]. 激光杂志, 2001, 22(6): 15-18 |
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| 作者姓名： | 刘敬伟 曾晓雁 |
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| 作者单位： | 华中科技大学激光技术国家重点实验室，武汉430074 |
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| 基金项目： | 国家自然科学基金资助项目 (50 0 750 3 0 ) |
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| 摘 要： | 本文归纳了激光直写布线技术的特点，重点综述了该技术在电子线路板的应用及在国内外发展的现状，并展望了激光直写技术的应用前景。
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| 关 键 词： | 激光直写 电子线路板 布线技术 |
| 修稿时间： | 2001-04-25 |
Status and Prospect of Laser Direct Writing |
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| Liu Jingwei Zeng Xiaoyan. Status and Prospect of Laser Direct Writing[J]. Laser Journal, 2001, 22(6): 15-18 |
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| Authors: | Liu Jingwei Zeng Xiaoyan |
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| Abstract: | The basic technique characteristics of laser direct writing were compared with those of the main traditional methods of circuit board-making.According to the difference of the reparation method,laser direct writing can be classified into three kinds:laser chemical vapor deposition,laser induce electroless plating and laser induce solid deposition.Especially,the status and the perspective of laser direct writing in domestic and oversea area were reviewed.Finally,some suggestions about how to develop the application of laser direct writing were presented. |
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| Keywords: | laser direct writing inducing vapor deposition electroless plating induce solid deposition |
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