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基于焊点虚拟成形技术的SMT焊点质量保证技术研究
引用本文:周德俭,黄春跃,吴兆华,李春泉.基于焊点虚拟成形技术的SMT焊点质量保证技术研究[J].计算机集成制造系统,2006,12(8):1267-1272.
作者姓名:周德俭  黄春跃  吴兆华  李春泉
作者单位:桂林工学院,电子与计算机系,广西,桂林,541004;桂林电子科技大学,机电与交通工程系,广西,桂林,541004;桂林电子科技大学,机电与交通工程系,广西,桂林,541004
摘    要:基于焊点形态理论和焊点虚拟成形技术的表面组装技术焊点质量检测与控制技术的基本思想是,将利用图像获取及处理技术得到的实际焊点形态,与通过焊点虚拟成形技术形成的合理焊点形态进行比较,根据比较的差异,通过智能鉴别得出实际焊点组装故障的类型与产生主因,然后形成调整组装工艺参数的反馈信息对相关组装工艺进行调整控制,以达到提高和保证焊点组装质量的目的。在阐述其基本思想和原理的基础上,结合实例介绍了该技术的实现方法与步骤,对其中焊点图像的获取与处理、焊点质量的分析评价等主要内容与关键技术进行了研究和探讨,并对结果进行了分析验证。

关 键 词:表面组装技术  焊点质量  虚拟成形  图像获取  检测与控制
文章编号:1006-5911(2006)08-1267-06
收稿时间:2005-06-07
修稿时间:2006-03-27

SMT solder joints quality assurance based on solder joints virtual evolving technology
ZHOU De-jian,HUANG Chun-yue,WU Zhao-hua,LI Chun-quan.SMT solder joints quality assurance based on solder joints virtual evolving technology[J].Computer Integrated Manufacturing Systems,2006,12(8):1267-1272.
Authors:ZHOU De-jian  HUANG Chun-yue  WU Zhao-hua  LI Chun-quan
Abstract:The principles of the Surface Mount Technology(SMT) solder joints quality assurance technology based on the solder joints shape theory and the solder joints virtual evolving technology could be described as following: the practical solder joint shape was obtained by image acquisition and compared with the reasonable solder joint shape obtained by solder joints virtual evolution technology firstly.Then based on the comparison,both the types and the causes of the practical solder joints assembly fault could be acquired by intelligent detection.Furthermore,feedback information used to adjust assembly process parameters was formed in order to adjust and control correlative assembly process.As a result,the assembly quality of the solder joints would be improved and guaranteed.Based on expatiation of the principles of the SMT solder joints quality assurance technology,its implementation method and steps were introduced with practical examples. Some key technologies,including image acquisition and processing,solder joints quality analysis and evaluation were also discussed.Some results were given as examples to verify feasibility of this technology.
Keywords:surface mount technology  solder joints quality  virtual evolving  image acquisition  detection and control
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