| SIP和SOC |
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| 引用本文： | 缪彩琴,翁寿松. SIP和SOC[J]. 电子与封装, 2005, 5(8): 9-12 |
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| 作者姓名： | 缪彩琴 翁寿松 |
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| 作者单位： | 1. 江苏无锡机电高等职业技术学校,江苏,无锡,214028
2. 无锡市罗特电子有限公司,江苏,无锡,214001 |
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| 摘 要： | 本文介绍了SIP和SOC的定义、优缺点和相互关系。SIP是当前最先进的IC封装,MCP 和SCSP是实现SIP最有前途的方法。同时还介绍了MCP和SCSP的最新发展动态。
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| 关 键 词： | 系统级封装 系统级芯片 多芯片封装 叠层芯片尺寸封装 |
| 文章编号： | 1681-1070（2005）08-09-04 |
| 收稿时间： | 2005-02-18 |
| 修稿时间： | 2005-02-18 |
SIP and SOC |
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| Miao Cai-qin,WENG Shou-song. SIP and SOC[J]. Electronics & Packaging, 2005, 5(8): 9-12 |
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| Authors: | Miao Cai-qin WENG Shou-song |
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| Abstract: | In this paper, the definition, the merits and the demerits and the mutual relation in the SIP and SOC are introduced. The SIP is a great advanced IC package at the present The MCP and the SCSP are a great future method for bring about the SIP The recent developments in the MCP and the SCSP are introduced also. |
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| Keywords: | SIP SOC MCP SCSP |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
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