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| SnAgCu系无铅钎料合金力学性能及钎焊性能研究 | |
| 引用本文： | 许天旱,金志浩,王党会.SnAgCu系无铅钎料合金力学性能及钎焊性能研究[J].稀有金属材料与工程,2009,38(8):1462-1466. |
| 作者姓名： | 许天旱 金志浩 王党会 |
| 作者单位： | 1. 西安石油大学,陕西,西安,710065;西安交通大学,陕西,西安,710049 2. 西安交通大学,陕西,西安,710049 3. 西安石油大学,陕西,西安,710065 |
| 基金项目： | 西安石油大学陕西省材料加工工程重点学科项目，西安石油大学青年基金 |
| 摘 要： | 利用光学显微镜、扫描电子显微镜(SEM)和能谱分析仪(EDX)及Instron电液伺服疲劳拉伸试验机,对SnAgCu系无铅钎料合金的力学性能和钎焊性能进行了研究.结果表明,适量的稀土元素Ce的添加显著地延长了Sn3Ag2.8Cu钎焊接头在室温下的蠕变断裂寿命,Sn3Ag2.8Cu-0.1Ce钎焊接头的蠕变断裂寿命超过Sn3Ag2.8Cu钎料的9倍;同时,使Sn3Ag2.8Cu合金的延伸性能也得到了显著改善,伸长率达到15.7%;Sn3Ag2.8Cu-0.1Ce与铜基板的扩散层厚度比Sn37Pb厚,但是比Sn3Ag2.8Cu薄. |
| 关 键 词： | SnAgCu系 无铅钎料合金 拉伸性能 蠕变断裂寿命 钎焊性能 |
| 收稿时间： | 2008/7/31 0:00:00 |
| 修稿时间： | 2009/5/25 0:00:00 |
Study on Mechanical Property and Solder ability of SnAgCu System Lead-free Solder Alloy |
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| Xu Tianhan,Jin Zhihao and Wang Danghui.Study on Mechanical Property and Solder ability of SnAgCu System Lead-free Solder Alloy[J].Rare Metal Materials and Engineering,2009,38(8):1462-1466. | |
| Authors: | Xu Tianhan Jin Zhihao and Wang Danghui |
| Abstract: | The mechanical property and solder ability of SnAgCu system lead-free solder alloys were studied by means of optical microscopy, scanning electron microscopy(SEM), energy dispersive X-ray(EDX) and Instron electrohydraulic servo fatigue tensile tester. The results indicate that proper quantities of Ce can remarkably prolong the creep-rupture life of the Sn3Ag2.8Cu brazing joint at room temperature, and the creep-rupture life of the Sn3Ag2.8Cu-0.1Ce brazing joint is 9 times or more than that of the Sn3Ag2.8Cu; meanwhile, the elongation of the Sn3.0Ag2.8Cu-0.1Ce solder alloy is also obviously improved even up to 15.7%; the intermetallic layers of the Sn3Ag2.8Cu-0.1Ce with copper plate are thicker than that of Sn37Pb, but thinner than that of Sn3Ag2.8Cu. |
| Keywords: | SnAgCu system lead-free solder alloy tensile property creep-rupture life solder ability |
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