纳米硬度计研究多晶硅微悬臂梁的弹性模量

利用纳米硬度计通过微悬臂梁的弯曲试验来测量其力学特性是一种简便而有效的方法，具有很高的载荷分辨率，可精确测量微悬臂梁纳米级弯曲形变。运用该方法在研究微悬臂梁的弯曲形变过程中，必须考虑压头在微悬臂梁上的压入以及微悬臂沿宽度方向的挠曲。微悬臂梁采用普通的集成电路工艺(IC)制造。试验研究表明，多晶硅微悬臂梁的纯挠曲与载荷成很好的线性关系，呈现弹性变形，通过该线性关系可计算得到梁的弹性模量。测得的多晶硅微悬臂梁的弹性模量为156±(2.9%-6.3%)GPa。

Young's Modulus ofPolysilicon Microcantilever Beams by Deflection Using Nanoindentation

The validity of a novel, direct and convenient method formicromechanical property measurements by beam bending using a nanoindenter has been demonstrated. This method combines a very high load resolution with a nanometric precision in the determination of the microcantilever beam deflection. The method was described clearly. In the deflection of microbeams, the influence of the indenter tip pushing into the top of the microbeams and the curvature across its width must be considered. The measurements were made on singlelayer, microthick polysilicon beams that were fabricated using conventional integrated circuit (IC) fabrication techniques. The elastic deflection of a polysilicon microcantilever beam will vary linearly with the force and the deformation is thought to be elastic. Furthermore, it suggests that Young's modulus of the beam can be determined from the slope of this linear relation. From the load-deflection data acquired during bending the mechanical properties of the thin films were determined. Measured Young's modulus is 156±(2.9%-6.3%) GPa.