| 黑瓷封装IC外引线镀锡后连锡短路的故障处理 |
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| 引用本文： | 杨建功,吴彩霞. 黑瓷封装IC外引线镀锡后连锡短路的故障处理[J]. 电镀与涂饰, 2001, 20(5): 34-35 |
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| 作者姓名： | 杨建功 吴彩霞 |
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| 作者单位： | 西安微电子技术研究所, |
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| 摘 要： | 分析了黑瓷封装IC外引线镀锡中出现的封装玻璃发白、表面粗糙、封装玻璃与外引线连锡造成引线极间短路的原因，提出了解决方法。
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| 关 键 词： | 镀锡 连锡 黑瓷封装IC外引线 短路故障处理 |
| 文章编号： | 1001-227X(2001)05-0034-02 |
Trouble shooting cases in tin plating process for exo-wire of black ceramics sealed IC |
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| YANG Jian-gong,WU Cai-xia. Trouble shooting cases in tin plating process for exo-wire of black ceramics sealed IC[J]. Electroplating & Finishing, 2001, 20(5): 34-35 |
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| Authors: | YANG Jian-gong WU Cai-xia |
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| Abstract: | Causes for the problems in tin plating process for exo wire of black ceramics sealed IC were discussed such as whiten of sealing glass, rough glass surface, continuous tin electrodeposits on sealing glass and exo wire. Solutions were presented. |
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| Keywords: | tin plating continuous tin electrodeposit |
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