| Abstract: | High-performance compact heat sinks have been developed for the effective cooling of high-density LSI packaging. Heat transfer and pressure loss characteristics of the heat sinks in both air-cross-flow and air-jet cooling have been experimentally studied. The present heat sinks were of plate-fin and pin-fin arrays with a fin pitch of 0.7 mm. The plate-fin heat sinks had higher cooling performance than the pin-fin heat sinks in the range of large airflow rates both in air-cross-flow and air-jet cooling. The thermal conductance in cross-flow cooling was 20 or 40% larger than that in jet cooling. The correlation of Colburn j-factor/Fanning friction factor versus the Reynolds number for the present heat sinks was found to be very close to that of a conventional large-size heat exchanger. © Scripta Technica, Heat Trans Asian Res, 28(8): 687-705, 1999 |
