| Sn1-xBixO2纳米粉体的制备及其表征 |
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| 引用本文： | 申乾宏,乔秀清,穆成法,陈乐生,樊先平,杨辉.Sn1-xBixO2纳米粉体的制备及其表征[J].电工材料,2012(3):3-6,10. |
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| 作者姓名： | 申乾宏 乔秀清 穆成法 陈乐生 樊先平 杨辉 |
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| 作者单位： | 浙江大学材料科学与工程学系;浙江大学浙江加州国际纳米技术研究院;温州宏丰电工合金股份有限公司 |
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| 摘 要： | 以SnCl4.5H2O和BiCl3为原料,采用化学共沉淀法制备了不同Bi掺杂量的SnO2纳米粉体,利用热重-差热(TG-DTA)、X射线衍射(XRD)和扫描电子显微镜(SEM)对制备的粉体进行了表征。结果表明,当Bi掺杂量低于30%时,SnO2纳米粉体的晶体结构保持为金红石四方相结构,Bi原子部分置换了Sn的位置;当掺杂量为30%时,开始形成杂质相BiOCl。掺杂Bi元素可细化SnO2纳米晶粒,经700℃焙烧后,未掺杂Bi元素的SnO2晶粒尺寸约为29 nm,而掺杂Bi元素的SnO2晶粒尺寸约为10 nm。此外,Bi元素的掺杂还可在一定程度上提高SnO2粉体的密度。
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| 关 键 词： | SnO2 Bi掺杂 纳米粉体 晶粒尺寸 密度 电接触材料 |
Synthesis and Characterization of Sn1-xBixO2 Nano-powder |
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| SHEN Qian-hong,QIAO Xiu-qing,MU Cheng-fa,CHEN Le-sheng,FAN Xian-ping,YANG Hui.Synthesis and Characterization of Sn1-xBixO2 Nano-powder[J].Electrical Engineering Materials,2012(3):3-6,10. |
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| Authors: | SHEN Qian-hong QIAO Xiu-qing MU Cheng-fa CHEN Le-sheng FAN Xian-ping YANG Hui |
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| Affiliation: | 1,3(1.Department of Materials Science and Engineering,Zhejiang University,Hangzhou 310027,China;2.Wenzhou Hongfeng Electrical Alloy Co.,Ltd.,Zhejiang Wenzhou 325603,China;3.Zhejiang-California International NanoSystems Institute,Zhejiang University,Hangzhou 310029,China) |
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| Abstract: | Nano-crystalline of tin oxide doped with varying mol% of Bi3+ was prepared using chemical coprecipitation method and characterized by various techniques such as thermogravimetry and differential thermal analysis(TG-DTA),X-ray diffraction(XRD) and scanning electron microscopy(SEM).Results show that the nano-crystalline SnO2 maintains rutile structure when Bi doping concentration is less than 30% and the Bi atom-occupies the sites of Sn.When the doping concentration is 30%,impurity phase BiOCl begins to appear.Compared with the undoped SnO2,doping Bi element can decrease the crystal size of SnO2.The crystal size of pure nano-crystalline is about 29nm,while the crystal size of Bi-doped SnO2 is about 10nm.Moreover,doping Bi element can also increase the density of SnO2 powder to some extent. |
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| Keywords: | tin oxide Bi doping nano powder crystal size density contact materials |
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