电子制造与封装

介绍了电子制造、半导体制造、电子封装等的基本概念。广义的电子制造是指电子产品从市场分析、经营决策、工程设计、加工装配、质量控制、销售运输直至售后服务等活动的全过程,而狭义的电子制造则指的是电子产品从原料(如硅片)开始到产品系统的物理实现过程,尤指大规模的工业化运作。电子制造包括半导体制造和电子封装与组装。

Electronic Manufactoring and Electronic Packaging

This paper contains the explaination of the concepts of manufacture, electronic manufacturing,semiconductor manufacturing and electronic packaging. Elecrtronic manufacturing is defined in broadsense to be a whole processes of the activities about market analyzing, decision-making, engineeringdesigning, machining, assembling, quality control, selling, transporting, after servicing etc. And the definitionof electronic manufacturing in narrow sense means that it is a processes to make or process (a rawmaterial) into a finished electronic products, especially by means of a large-scale industrial operation.Electronic manufacturing consist of semiconductor manufactruing, electronic packaging and assembling.