| Sn-Ag-Cu-Ce无铅钎料合金体系的热力学计算及预测 |
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| 引用本文： | 薛松柏,陈燕,吕晓春.Sn-Ag-Cu-Ce无铅钎料合金体系的热力学计算及预测[J].焊接学报,2005,26(5):20-22. |
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| 作者姓名： | 薛松柏 陈燕 吕晓春 |
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| 作者单位： | 1. 南京航空航天大学,材料科学与工程学院,南京,210016
2. 哈尔滨焊接研究所,哈尔滨,150080 |
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| 摘 要： | 利用周模型对Sn—Ag—Cu—Ce无铅钎料合金体系进行了热力学计算预测。热力学计算结果表明，Ag、Cu含量(质量分数)分别为0．5％-4．5％时，当Ce的含量(质量分数)超过0．05％时，体系达到化学平衡状态；当Ce的含量(质量分数)达到0．6％左右时，Sn、Ag、Cu分别都出现了“等活度系数”现象。这一研究结果可为无铅钎料合金的成分设计提供理论指导。
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| 关 键 词： | 无铅钎料 周模型 化学平衡 等活度系数 |
| 文章编号： | 0253-360X(2005)05-20-03 |
| 收稿时间： | 2005/2/25 0:00:00 |
Thermodynamic calculation and evaluation for Sn-Ag-Cu-Ce lead-free solder alloy system |
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| XUE Song-bai,CHEN Yan and L&#; Xiao-chun.Thermodynamic calculation and evaluation for Sn-Ag-Cu-Ce lead-free solder alloy system[J].Transactions of The China Welding Institution,2005,26(5):20-22. |
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| Authors: | XUE Song-bai CHEN Yan and L&#; Xiao-chun |
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| Affiliation: | XUE Song-bai,CHEN Yan,L(U) Xiao-chun |
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| Abstract: | Thermodynamic calculation and evaluation for Sn-Ag-Cu-Ce lead-free solder alloy system were carried out by means of Chou model.The results showed that chemical balance attained in the system of Sn(rest)Ag(0.5 wt.%-4.5 wt.%)Cu(0.5 wt.%-4.5 wt.%) when the content of Ce was over 0.05wt.%.The equivalent activity coefficient phenomenon of Sn,Ag and Cu emerged in the system when the content of Ce increased to about 0.6wt.%.The results will provide theoretical guidance for designing chemical constitutions of new lead-free solders. |
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| Keywords: | lead-free solders Chou model chemical balance equivalent activity coefficient |
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