Cu-Ti+Mo连接2D C/SiC复合材料与GH783的接头微结构与性能

采用Cu-Ti+Mo复合焊料,在真空条件下对2D C/SiC复合材料和GH783镍基合金进行连接,分析接头的显微组织结构,研究Mo含量对接头组织及性能的影响.结果表明:接头由界面反应层、应力缓解层、软金属层和扩散层4个区域组成,接头致密,无孔洞、裂纹等缺陷.随着Mo含量的增加,接头的连接强度不断增加:当Mo含量为15％(体积分数)时,接头连接强度达到最大( 141 MPa);当Mo含量大于15％时,接头的连接强度开始下降.Mo的加入,缓解了接头的残余应力、抑制了Ti对C/SiC的过度侵蚀,从而有效提高接头的连接强度.

Microstructure and Properties of 2D C/SiC Composite/GH783 Joint Brazed with Cu-Ti+Mo Composite Filler

Using Cu-Ti+Mo composite filler, 2D C/SiC composite was brazed to GH783 nickel-based alloy under vacuum condition. The microstructure of the joint and the effect of Mo content on microstructure and properties of joints were investigated. The results show that the joint is composed of 4 regions: interface reaction layer, stress relief layer, soft metal layer and diffusion layer, without holes, cracks or other defects. The maximal flexural strength reaches 141 MPa with 15% (mass fraction) Mo particles in the joint, and the flexural strength of the joint declines when Mo content exceeds 15%. The Mo addition releases the residual stress of the joint, and inhibits excessive reaction between Ti and C/SiC, thus effectively improving the strength of the joint.